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In the past, quantum computing was largely reserved for researchers, physicists, and scientists with direct access to physical quantum computing systems. But the game has changed, thanks to the cloud. Barriers to quantum computing are coming down quickly.
Today, cloud access (like D-Wave’s Leap 2 quantum application environment) and improvements in quantum computing hardware, software, and developer tools are allowing programmers around the world to code on live quantum computers in real-time. Developers, students, and researchers around the world can now tap into the power of a quantum via their browser — quantum mechanical knowledge not required. Users and private companies have already built over 200 early applications on D-Wave’s computers in industries ranging from automotive to machine learning, aerospace, finance, and beyond. The quantum application era is here, and the growing quantum developer community is making it a reality.
In this session, Murray Thom, Vice President of Software and Cloud Services at D-Wave, will talk about the burgeoning quantum application development ecosystem, and how developers can start learning to code on a quantum computer today. This includes a walkthrough of Leap 2, D-Wave's new quantum cloud service equipped with hybrid solvers, and D-Wave's Ocean SDK. Murray will also explore some of the early applications that developers and companies have built to-date.
Type: Talk (45 mins); Python level: Beginner; Domain level: Beginner
Murray Thom is Vice President of Software and Cloud Services at D-Wave, responsible for the Leap quantum application environment, Ocean tools, system software, and documentation. Previously Murray led a team engaged in customer projects related to algorithms, applications, and performance testing. Since joining the company in 2002 Murray has been involved in all aspects of systems engineering and processor development for D-Wave's quantum computers. Some of these project areas include cryogenic refrigeration systems, superconducting electrical filters, cryogenic chip packaging, magnetic screening and shielding, QPU signals, and automated test systems.